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      • Wize Alliance and Wize Technology
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      • RC232
      • Tinymesh™
      • Sigfox
      • ZNM (ZigBee)
      • KNX-RF
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      • 6LoWPAN
      • CoAP – Constrained Application Protocol
      • DTLS – Datagram Transport Layer Security
      • Intelligent C-programmable I/O (ICI)
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      • One Footprint
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[RIIM] What application payload length is supported for uplink and downlink packet?

Around 84 Bytes.

    Last Update: September 29, 2021  

    September 29, 2021   683    RIIM Q&A  

    Related Knowledge Base Posts -

    • [RIIM] Can I buy a component of RIIM development kit individually?
    • [RIIM] Do you need a programmer to program the devices? I suppose the development boards can be programmed with the USB?
    • [RIIM] How many children can each node support?

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    • Home
    • Products
      • MIOTY Network
        • MIOTY Parts and Tools
        • MIOTY Development Kit
      • RIIM™ Network
        • RIIM™ Parts and Tools
        • Cloud To Sensor Prototype Network By RIIM™
        • RIIM™ Development Kit
      • RIIoT™ Network
        • The RIIoT™ Parts and Tools
        • RIIoT™ Development Kit
      • Wireless M-Bus
        • W-MBUS Sensor Interfacing Modules (MSM)
        • RC1702HP For Custom Applications
        • Wireless M-Bus Development Kit
      • WIZE
        • Wize Development Kit
      • RC232™
        • RC232™ Development Kit
      • Tinymesh
        • Tinymesh Development Kit
      • SIGFOX
        • SIGFOX Sensor Interfacing Modules (SSM)
        • SIGFOX development kit
      • ZNM (ZigBee)
        • ZNM Development Kit
      • KNX-RF
        • KNX Development Kit
      • Customizable
        • Customizable Development Kit
      • Development Kits
        • Buy A Development Kit/Samples
        • Development Kit Support
      • Expansion Boards For Gateways
      • USB Sticks
    • Services
      • Design Services
      • Partners
        • RIIM Gateway Partners
        • RIIoT Gateway Partners
        • Wireless M-Bus Gateway Partners
    • Applications
      • Emergency Lighting
      • EV Charger Communication
      • Smart Irrigation
        • Next-Gen Smart Irrigation Evaluation Kit
      • Smart Metering
        • Wireless M-Bus Smart Metering Modules
        • Mioty For Smart Metering
      • Smart Street Lighting
      • Solar
        • Next-Gen Solar Evaluation Kit
      • Sub-Metering
      • Wireless Sensor Networks
      • Success Stories and Reference Cases
    • Technologies
      • Protocols
        • RIIM
        • Wireless M-Bus
        • Wize Alliance and Wize Technology
        • Wireless Modbus
        • RIIoT™ RF
        • RC232
        • Tinymesh™
        • Sigfox
        • ZNM (ZigBee)
        • KNX-RF
      • Technology Features
        • 6LoWPAN
        • CoAP – Constrained Application Protocol
        • DTLS – Datagram Transport Layer Security
        • Intelligent C-programmable I/O (ICI)
        • OMS (Open Metering System)
        • One Footprint
        • Performance Boosters
        • TSCH – Time Synchronized Channel Hopping
    • News
    • Resources
      • Blog
      • Document Library
        • Application Notes
        • Datasheets
        • Development Kit Documentation
        • Product User Manuals
        • Reference Designs
        • SDK Documentation
        • Software Tools Documentation
        • Tutorials
        • White Papers
      • Declarations of Conformity
      • PCN & Errata
        • FW Product Change Notifications
        • HW Product Change Notifications
      • Quality & Certification
      • Supporting Software & Software Tools
        • Supporting Software Descriptions
      • Webinars & Video Snippets
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